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TECHNOMELT PA 673 N BG - 20kg (hot melt adhesive, amber)

TECHNOMELT PA 673 N BG - 20kg (hot melt adhesive, amber) (IDH.319194)

Product description:
TECHNOMELT® PA 673 N is a one-component industrial grade Polyamide Hot Melt Adhesive designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage. Once applied TECHNOMELT® PA 673 N solidifies to form a barrier between electronics and the environment. It is a resilient encapsulant with good heat stability and moisture resistance. Typical applications include potting electronics modules, molding strain relief into wiring and encapsulation of sensors. It is a versatile adhesive providing a good balance of low and high temperature performance. Further information about the product: biuro@woronko-kleje.pl

Directions for use:
1. Use gloves to minimize skin contact. DO NOT use solvents for cleaning hands.
2. The surfaces of the substrate must be dry and free from oil, grease, and dust.
3. Material has been formulated to provide the best possible moldability and as wide a molding latitude as possible.
4. Much of the final molding parameters will be determined by the mold design.
5. Molding temperature will vary from situation to situation, range shown on this data sheet is a starting range for process development.
6. When potting to a substrate with high thermal conductivity the use of a specific application temperature is required for good wetting.
7. Do not heat the product above the specified application temperature range.
8. When the product is not in use do not apply heat, this will degrade the quality of the product and in extreme cases cause carbonization or charring.
9. Carbonized material must be removed mechanically.
10. Removal of the thermoplastic material from the hot apparatus can be achieved with solvent free cleaning system, such as TECHNOMELT® PA 62 (see separate technical information). Check for availability in your region.

Storage:
Store product in the unopened container in a cool dry location. Storage information may be indicated on the product container labeling.Optimal Storage: Up to 28° C. Storage above 35° C can adversely affect the ability to handle and dispense the material. Material will absorb moisture from the air. Material from opened containers should be transferred immediately into airtight containers. Material should be stored in sealed containers in a cool location to maximize shelf life. Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated.

Parameters:
TYPICAL MATERIAL PERFORMANCE (Tested at 23°C):
Physical Properties:
  • Hardness, Durometer A, DIN EN ISO 868/15s : 90
  • Elongation, % ISO 527, Specimen no.5, Cross-head-speed: 50 mm/min : 400
  • Low Temperature Flexibility, °C ASTM D3111 : -40
  • Temperature Creep Resistance, °C, Henkel MH 11 Method : 160
  • Glass Transition Temperature (Tg), °C, DSC Second run : -45
  • Tensile at break ISO 527, Specimen no.5 N/mm² : 5.5
  • Yield Strength ISO 527, Specimen no.5 Cross-head-speed 50mm/min, N/mm² : 4.9
  • E-modulus ISO 527 N/mm² : 65

    Electrical Properties:
  • Dielectric Constant / Dissipation Factor ASTM D150:
    - 1MHz 3.7/0.084
    - 1GHz 2.7/0.032
    - 1.8GHz 2.9/0.047
  • Dielectric Strength, kV/mm IEC 60243 : 20

    Further information about product you can find in the technical data sheet
  • Assortment