LOCTITE SI 5300 - 310ml (high temperature silicone (up to 350 °C) for sealing metal flanges)
No.
IDH.2558929
Product description:
LOCTITE® SI 5300™ is generally used for sealing applications, but also for bonding and for high temperature protection. It isprimarily used in industrial bonding/sealing applications, heating engineering, industrial ovens, household electrical and industrial heating equipment. This product is typically used in applications up to 350 °C. Further information about the product: biuro@woronko-kleje.pl
Directions for use:
1. For best performance bond surfaces should be clean and free from grease.
2. Moisture curing begins immediately after the product is exposed to the atmosphere, therefore parts to be assembled should be mated within a few minutes after the product is dispensed.
3. The bond should be allowed to cure before subjecting to heavy service loads.
4. Excess material can be easily wiped away with non-polar solvents.
5. For full automatic applications a volumetric dispensing system is recommended.
Storage:
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.Optimal Storage: 8 °C to 21 °C. Storage below 8 °C or greater than 28 °C can adversely affect product properties. Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated.
Parameters:
Shore Hardness, ISO 868, Durometer A : 31 Linear Shrinkage, % : 0.32 Volume Shrinkage, % : 0.97 Coefficient of Thermal Expansion, ISO 11359-2, K : -1 330×10-6 Coefficient of Thermal Conductivity ISO 8302, W/(m·K) : 0.63 Tensile Strength, ISO 37, N/mm² : 1.6 Tensile Modulus, ISO 37, N/mm² : 1.0 Elongation, at break, ISO 37, % : ≥260
Full technical information can be found in the technical data sheet
LOCTITE® SI 5300™ is generally used for sealing applications, but also for bonding and for high temperature protection. It isprimarily used in industrial bonding/sealing applications, heating engineering, industrial ovens, household electrical and industrial heating equipment. This product is typically used in applications up to 350 °C. Further information about the product: biuro@woronko-kleje.pl
Directions for use:
1. For best performance bond surfaces should be clean and free from grease.
2. Moisture curing begins immediately after the product is exposed to the atmosphere, therefore parts to be assembled should be mated within a few minutes after the product is dispensed.
3. The bond should be allowed to cure before subjecting to heavy service loads.
4. Excess material can be easily wiped away with non-polar solvents.
5. For full automatic applications a volumetric dispensing system is recommended.
Storage:
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.Optimal Storage: 8 °C to 21 °C. Storage below 8 °C or greater than 28 °C can adversely affect product properties. Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated.
Parameters:
Full technical information can be found in the technical data sheet