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LOCTITE Eccobond UF 8830S - 16g
No.
IDH.2017490
LOCTITE Eccobond UF 8830S - 16g
Product description:
LOCTITE ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGAapplications. It is designed to improve crack/fracture resistance and deliver faster flow. When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance. Further information about the product: biuro@woronko-kleje.pl
Directions for use:
For safe handling information on this product, consult the Safety Data Sheet, (SDS).
Storage:
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.
Optimal Storage : -40 °C
Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.
Parameters:
Technology : Epoxy Appearance : Grey paste Product Benefits:
- High purity
- High TG, low CTE
- Improved toughness
- Good flow with self filleting
- Long staging time and worklife
- 260ºC reflow capability for Pb-free, low-k applications Cure : Heat cure Application : Underfill Typical Package Application : Flip Chip BGA Viscosity, Brookfield , °C, mPa·s (cP), Spindle 51, Speed 5 rpm : 22,120 Thixotropic Index : 0.85 Specific Gravity at 25ºC : 1.6 Work Life at 25°C, (100% increase in viscosity), hours : >24 Shelf Life at -40°C, days : 365 Coefficient of Thermal Expansion , TMA, ppm/°C:
- Below Tg : 25
- Above Tg : 100 Glass Transition Temperature (Tg), °C:
- By TMA : 118
- By DMA 126.5
Further technical informations can be found in technical data sheet
LOCTITE ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGAapplications. It is designed to improve crack/fracture resistance and deliver faster flow. When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance. Further information about the product: biuro@woronko-kleje.pl
Directions for use:
For safe handling information on this product, consult the Safety Data Sheet, (SDS).
Storage:
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.
Optimal Storage : -40 °C
Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.
Parameters:
- High purity
- High TG, low CTE
- Improved toughness
- Good flow with self filleting
- Long staging time and worklife
- 260ºC reflow capability for Pb-free, low-k applications
- Below Tg : 25
- Above Tg : 100
- By TMA : 118
- By DMA 126.5
Further technical informations can be found in technical data sheet
