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LOCTITE 3616 - 300ml (Chipbonder)

LOCTITE 3616 - 300ml (Chipbonder) (IDH.142884)

Product description:
LOCTITE 3616 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics, and high print speeds are required. Further information about the product: biuro@woronko-kleje.pl

Directions for use:
1. LOCTITE 3616 is suitable for all common open squeegee and enclosed head stencil printing systems, such as ProFlow, PumpPrint, Varidot. Loctite stencil print Chipbonders are suitable for print speeds of 20 mm/s up to 150 mm/s - this will vary with product selected and printer set-up.
2. After storage in a refrigerator the adhesive must be allowed to equilibrate to room temperature before use, typically 2 to 4 hours.
3. Printing conditions should be about 25°C, and RH less than 70 % for optimum results. Higher temperatures will decrease the viscosity and will effect the printing results. Higher humidity conditions may lead to moisture pick up and will reduce the "on stencil" life of the product: At 25°C, 55 % RH, the product will remain dispensable on the stencil for a maximum of 5 days of continuous operation. The quality of the print results will depend on board support, print gap, print speed, print pressure and separation speed.
4. Typical starting parameters (steel stencil/ steel squeegee/ single stroke mode*):
*For higher dots Print and Flood Mode can be used. Set up pressure for front squeegee as described above. For floodprinting, rear squeegee pressure should be set to 0 kg to leave a sufficient adhesive layer (1 to 2 mm) on the stencil. Theseparameters will vary depending on type of printing process and should be optimized accordingly.
5. Uncured adhesive should only be cleaned from the board with isopropanol, MEK or ester blends such as LOCTITE 7360. Alcohols (e.g. Isopropanol) can cure the adhesive and may lead to blocked apertures if left on the stencil for over 5 minutes. Automatic under-stencil-wipe is not recommended.
6. Cured adhesive can only be removed mechanically with the aid of heat.

Storage:
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than 8 °C can adversely affect product properties.
Material removed from containers may be contaminated during use. Do not return product to the original container.
Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated.

Parameters:
  • Specific Gravity at 25 °C : 1.33
  • Specific Heat, kJ/(kg·K) : 0.3
  • Density, BS 5350-B1 at 25 °C, g/cm³ : 1.3
  • Glass Transition Temperature ISO 11359-2, °C : 140
  • Lap Shear Strength, ISO 4587( Cured for 30 minutes at 150 °C):
    -Steel (grit blasted), N/mm² : ≥15

    Full technical information can be found in the technical data sheet
  • Assortment