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LOCTITE GC 10 - 500g Solder paste type 4
No.
IDH.2002845
LOCTITE GC 10 - 500g Solder paste type 4
Product description:
LOCTITE GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its novel formulation strategy increases both field application yields and on-line paste utilization. LOCTITE GC 10 also shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surfacefinishes and component metallizations including immersion Ag, OSP-Cu, ENIG and CuNiZn. It supports excellent reflow to overcome industry wide HiP and NWO challenges. The new flux chemistry protects the solder joint longer, improves coalescence and optimizes wetting performance, allowing for very shiny solder joints. LOCTITE GC 10 is suitable for use with industry standard SAC alloys. Further information about the product: biuro@woronko-kleje.pl
Directions for use:
Printing:
● LOCTITE GC 10 is available for stencil printing with Type 3, Type 4 and Type 5 powder.
● Printing at speeds between 25 to 125 mms-1 can be achieved using laser cut, electropolished or electroformed stencils with metal squeegees.
Reflow:
● Suitable for convection, IR, hot belt and vapor phase.
● Proven profiles for multiple circuit board configurations.
Cleaning:
Cleaning Solder Paste from Stencils:
● LOCTITE GC 10 is a no-clean solder paste designed to be left on the PCB in many applications post assembly; it does not pose a hazard to long-term reliability
● For stencil cleaning and cleaning board misprints, LOCTITE MSC 01 solvent cleaner is recommended
Cleaning Solder Paste from Circuit Boards:
● Residues can be removed using conventional cleaningprocesses based on solvents, such as LOCTITE MCF 800.
● Cleaning of some assemblies is best conducted in an ultrasonic bath.
● Tap water is not recommended for rinsing. Ionic impurities present in tap water can lead to reduced reliability of the assembly.
Storage:
Optimal storage: 5 to 25ºC (± 1.5°C) Storage information may be indicated on the product container labelling. Material removed from containers may be contaminated during use. Do not return products to the original container. Henkel Corporation cannot assume responsibility for product that has been contaminated or stored under conditions other than those previously indicated.
Full technical information can be found in the technical data sheet.
LOCTITE GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its novel formulation strategy increases both field application yields and on-line paste utilization. LOCTITE GC 10 also shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surfacefinishes and component metallizations including immersion Ag, OSP-Cu, ENIG and CuNiZn. It supports excellent reflow to overcome industry wide HiP and NWO challenges. The new flux chemistry protects the solder joint longer, improves coalescence and optimizes wetting performance, allowing for very shiny solder joints. LOCTITE GC 10 is suitable for use with industry standard SAC alloys. Further information about the product: biuro@woronko-kleje.pl
Directions for use:
Printing:
● LOCTITE GC 10 is available for stencil printing with Type 3, Type 4 and Type 5 powder.
● Printing at speeds between 25 to 125 mms-1 can be achieved using laser cut, electropolished or electroformed stencils with metal squeegees.
Reflow:
● Suitable for convection, IR, hot belt and vapor phase.
● Proven profiles for multiple circuit board configurations.
Cleaning:
Cleaning Solder Paste from Stencils:
● LOCTITE GC 10 is a no-clean solder paste designed to be left on the PCB in many applications post assembly; it does not pose a hazard to long-term reliability
● For stencil cleaning and cleaning board misprints, LOCTITE MSC 01 solvent cleaner is recommended
Cleaning Solder Paste from Circuit Boards:
● Residues can be removed using conventional cleaningprocesses based on solvents, such as LOCTITE MCF 800.
● Cleaning of some assemblies is best conducted in an ultrasonic bath.
● Tap water is not recommended for rinsing. Ionic impurities present in tap water can lead to reduced reliability of the assembly.
Storage:
Optimal storage: 5 to 25ºC (± 1.5°C) Storage information may be indicated on the product container labelling. Material removed from containers may be contaminated during use. Do not return products to the original container. Henkel Corporation cannot assume responsibility for product that has been contaminated or stored under conditions other than those previously indicated.
Full technical information can be found in the technical data sheet.
